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A wrap-up of news across the networking industry.

Fujitsu's TransLambda delivers 3X optical capacity in C-band

Fujitsu Network Communications unveiled TransLambda technology,  an ultra-high capacity, wavelength-division multiplexing (WDM) multiband transmission system (MTS) that substantially expands the transmission capacity of optical fiber networks without deploying new L- and S- band dedicated transceivers.

Fujitsu's TransLambda packs multiple transmission bands into a single fiber using all-optical wavelength conversion (AOWC). TransLambda enables up to three times the capacity for data center interconnect (DCI) and long-haul transport networks. Specifically, TransLambda fiber capacity multiplier technology offers ultra-high capacity — up to 76.8Tb/s of data using 192 channels at 400G speeds per 75GHz channel — in a plug-and-play blade using C-band transponders.

The company said this 3X boost is particularly crucial for those applications where C-band transmission is the only available option for the foreseeable future, such as optical links that use direct-attach or transponder-attach ZR/ZR+ pluggable coherent optics.

The Fujitsu TransLambda Test Kit, which is currently being used in customer lab trials, is offered in a single blade configuration that can be used with any legacy WDM network architecture including multi-vendor systems.

“TransLambda technology is just the latest in a line of innovations from Fujitsu to achieve the highest network speed and capacity as cost-efficiently as possible, helping our customers gain true competitive advantage in today’s demanding marketplace,” said Paul Havala, vice president of global planning at Fujitsu Network Communications. “Our TransLambda fiber multiplier approach is a much more cost-efficient way to achieve significant capacity increases without installing L-band equipment, addressing cost and operational overhead while seamlessly integrating into existing network architecture to fully leverage deployed fiber assets.”

https://www.fujitsu.com/us/about/resources/news/press-releases/2020/fnc-20200309.html
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Inphi samples 800G 7nm PAM4 DSP

Inphi is sampling its new Spica 800G 7nm PAM4 DSP, the world’s first 800Gbps or 8x100Gbps PAM4 DSP to enable 800G optical transceiver modules in QSFP-DD800 or OSFP form factors.

Inphi's highly integrated Spica 800G platform includes the company's high-performance, low power PAM4 DSPs alongside its companion market-leading low power linear driver and TIAs.

The company said its Spica 800Gbps PAM4 DSP with integrated 56GBaud driver, enables either 2x400Gbps or 8x100Gbps optical modules with 100Gbps per lane electrical interfaces. Applications could include 800Gbps / 8x100Gbps optical interconnects in a compact form factor for single-mode fibers or multimode fibers. The Spica platform could be matched with Inphi’s 112Gbps Capella SerDes IP for next-generation AI processors and switches.


Key product attributes of the Spica platform:

  • Low power consumption for next-generation module applications, targeting 14W 800Gbps, 2x400Gbps or 8x100Gbps optical modules with 100Gbps electrical interfaces
  • Targeting 8W 400Gbps QSFP112 optical modules with 100Gbps electrical interface
  • Integrated 56Gbaud laser driver with direct-drive capability
  • Enables customers to develop 800Gbps / 8x100Gbps optical interconnects in a compact form factor for applications with single-mode fibers or multimode fibers
  • The supporting 56GBaud linear TIA product family provide packaging flexibility for excellent linearity, high bandwidth, adjustable gain to optimize the PAM4 system performances and wide dynamic range to meet the different performance and link requirements for optical applications
  • Implemented in a small form factor and power efficiency on proven, high-volume 7nm process technology node, ensuring fastest time to production
  • Ease of migration with compatible API Software Suite

Spica Linear Drivers

  • The IN5630SE/IN5634SE is a 56GBaud low power single/quad linear driver for PAM4 optical modules. Features include:
  • Excellent linearity, high bandwidth, adjustable gain to optimize the PAM4 system performances
  • Low-power EML driver in small package or in bare die form

Spica Linear TIA’s
The IN5665TA is a 56GBaud low power single/quad linear TIA for PAM4 optical modules. Features include:

  • Wide dynamic range to meet the different performance and link requirements for optical applications
  • Excellent signal integrity necessary for PAM4 modulation schemes
  • Low-power and small form factor

https://www.inphi.com/
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Inphi samples its 3rd gen, single-lambda PAM4

Inphi has begun sampling its Porrima Gen3 Single-Lambda PAM4 platform based on 7nm technology and optimized for hyperscale data center networks. The new design offers an expanded feature set and enhanced direct drive capability, further expanding the breadth of lasers that can be used with the integrated laser driver. The new platform is also designed to reduce total module power consumption to less than 8W for 400Gbps DR4/FR4 mode in the QSFP-DD form factor.

“Porrima Gen3 is another prime example of our ongoing dedication to this market, by increasing investments to exceed customer needs and stay ahead of the competition,” said Eric Hayes, SVP, Networking Interconnect, Inphi. “Not only are we delivering better performance and lower power with this third-generation PAM4 solution, but we are also making it easy for customers to make a smooth transition. This will accelerate adoption of this total solution and maintain our market leadership position.”

Porrima Gen3 Key attributes and Benefits:

  • Compatible API and software suite with Porrima Gen1 and Gen2 ensure smooth transition in deployment
  • Backward pin-to-pin compatibility allows minimum hardware changes on module design
  • Low-power consumption for next-generation module applications, enabling <8w 400gbps="" 4x100gbps="" 8x50gbps="" electrical="" interfaces="" li="" modules="" optical="" with="">
  • Integrated 56Gbaud laser driver with direct-drive capability
  • Implemented in small form factor and power efficiency on proven, high-volume 7nm process technology node, ensuring fastest time to production
  • Numerous self-test and loopback modes that allow diagnostic monitoring of channel and system parameters
  • Modular API software suite that covers link margin and stress testing along with data and error analytics

Porrima Gen3 IN566x Linear TIA:

  • The IN5661TA/5664TA is a 56GBaud low power single/quad linear TIA for PAM4 optical modules. Features include:
  • Wide dynamic range to meet the different performance and link requirements for optical applications
  • Excellent signal integrity necessary for PAM4 modulation schemes
  • Low-power and small form factor



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Arista announces OSFP Optical Line System for 400G

Arista Networks announced an optical line system in an OSFP (Octal Small Form-factor Pluggable) module form factor. The OSFP-LS line system was purposely conceived and designed for the support of 400G ZR digital coherent optics.

The Arista OSFP-LS collapses legacy optical line systems into an OSFP module which can be plugged into any Arista OSFP port, supporting up to 8 DWDM wavelengths with a single fiber pair, and delivering up to 3.2Tbps of DCI traffic over 100km.

Arista describes its OSFP-LS as a highly compact, low power and cost-effective solution for increasing bandwidth between data centers without the need for external optical line systems. Features also include automatic setup with no operator configuration required.

“The OSFP-LS is far easier to deploy than conventional external line systems that require their own power feed and control management software while consuming valuable rack space. Interconnecting two data center sites with DWDM becomes as simple as connecting two switch ports,” said Hacene Chaouch, Distinguished Engineer, Arista Networks.

The OSFP-LS is in testing and qualification now with availability in 2H 2020.



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Ciena and Arista conduct 400GE interoperability test

Ciena and Arista recently completed an interoperability test of their respective 400GE transport solution and high density native 400GE router.

The interoperability test leveraged Ciena’s Waveserver 5, powered by WaveLogic 5 Extreme (WL5e) coherent optics, and Arista’s 7280DR3 to show how high-bandwidth 100GE and 400GE client traffic can be maximized across any distance, supporting fiber capacities up to 38.4Tbps. The testing included successful transport of two 400GbE client signals from Arista’s 7280DR3 across a single WL5e 800G wavelength on Ciena’s Waveserver 5, demonstrating the most capacity achieved in the industry over a single set of electro-optics.

Ciena’s Waveserver 5 supports up to 12.8Tbps in a compact 2RU footprint and enables providers to maximize transport of high-bandwidth 100GE and 400GE client traffic across any distance using minimal hardware. Arista’s 7280DR3-24 router supports 9.6Tbps of throughput with 24x400GE ports in an ultra-compact 1RU footprint.
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NeoPhotonics releases 64 GBaud High Bandwidth Coherent Driver Modulator

NeoPhotonics announced general availability and volume production of its 64 GBaud High Bandwidth Coherent Driver Modulator (HB-CDM).

This CDM joins NeoPhotonics a 64 GBaud Intradyne Coherent Receiver (ICR) and ultra-narrow linewidth tunable laser to enable customers to implement single channel 600G data transmission over data center interconnect (DCI) distances of approximately 80 km using 64 QAM. These components also support 400G over metro distances of 400-600 km using 64 GBaud and 16 QAM or 200G over long-haul distances of greater than 1000 km using 64 GBaud and QPSK.

The device is implemented in a small form factor (25 x 12 x 5 mm) package which co-packages a linear, quad-channel, differential 64 GBaud driver with an Indium Phosphide based Mach-Zehnder (MZ) quadrature modulator chip. It provides efficient coherent multi-level modulation formats, such as DP-QPSK, DP-16QAM and DP-64QAM, to support coherent transmission up to 64 GBaud. The HB-CDM is compliant to the OIF’s Implementation Agreement OIF-HB-CDM-01.0 “High Bandwidth Coherent Driver Modulator”, and assures users a 3dB EO bandwidth of greater than 40GHz. The compact size fits in a CFP2-DCO pluggable module.

NeoPhotonics HB-CDM is also available in a “C++” CDMTM Modulator version, which supports tuning across the full “Super C-band” covering 6.4 THz of spectrum or up to 50 percent more than standard systems. The C++ CDMTM Modulator, Ultra-Narrow Linewidth Tunable C++ LASERTM Micro-ITLA and 64 GBaud C++ ICRTM Receiver are combined in NeoPhotonics C++ CFP2-DCO transceiver, which is the industry’s first pluggable transceiver module able to deliver as much as 34 Terabits of capacity per fiber. This module can support 85 channels of 64 GBaud data at 75 GHz channel spacing and effectively increases the capacity of an optical fiber by as much as 50 percent over standard systems at comparable distances.

"We are pleased to add the HB-CDM to our suite of components for 64 GBaud coherent systems which are currently shipping in volume to multiple customers," said Tim Jenks, Chairman and CEO of NeoPhotonics. "The HB-CDM is based on our Indium Phosphide photonic integration platform and delivers the high performance for demanding applications. Combined with our Silicon Photonics integration platform we can provide customers with the optimized solutions to meet their network requirements for the highest speeds and at volume scale," concluded Mr. Jenks.
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UK mobile operators embrace Shared Rural Network

All four mobile operators in the UK reached an agreement to develop a Shared Rural Network.

The UK landmass that receives 4G coverage from all four of the UK’s mobile network operators will increase from 66% to 84%; each operator will provide 4G to at least 90% of the country’s landmass; Partial Not Spots will be virtually eliminated; and over 1,800sq miles of the country will get 4G for the first time.

Ofcom spokesperson: “We welcome this agreement, which will make a real difference to all mobile customers right across the UK. We are making the coverage commitments legally binding by including them in operators’ licences. We’ll also monitor and report on companies’ progress in bringing better coverage to people and businesses.”
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Oman Australia Cable enters contract-in-force status

A new Oman Australia Cable project has entered contract in force status (CIF). The developer, SUB.CO, expects final system connection to be completed in December 2021.

The OAC cable system design is a three (3) fibre pair system with an option to upgrade to four (4) fibre pairs based upon final demand and will span approximately 9,700 km, with branching units designed to potentially extend the system into Salalah, Oman and Djibouti in the future. It is the only cable along this route.

David Coughlan, CEO of SubCom noted: "Once deployed, OAC will enable high-capacity, low-latency transmission and open a much-sought route between Australia and EMEA. SubCom is very pleased to be moving forward with this project and we are confident in our ability to implement what will be a powerful and reliable system on behalf of SUB.CO."

https://sub.co/#release
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Flex cites COVAD-19 impact on contract manufacturing

As a result of the still-evolving COVID-19 situation, Flex (formerly Flextronics) expects its fourth quarter fiscal 2020 results to be negatively impacted and the company will not meet its current guidance.

“Our cross-functional teams have done an amazing job returning more than 80% of our colleagues back to work, in a disciplined and safe manner. On behalf of the Flex leadership team, my sincere thanks to all my Flex colleagues for their commitment to safety and dedication to ramping up production at our China factories,” said Revathi Advaithi, Chief Executive Officer of Flex. “We are working intently with our supply chain partners and are well-integrated with our customers as we navigate the disruptions from this situation. I am confident that now more than ever, our focus on execution and our ability to move with speed at scale will enable us to navigate through these events with discipline.”

More detail is expected on March 11.


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Broadband Forum appoints new leaders

Broadband Forum  announced the newly elected and re-elected members of its Board of Directors, re-election of its Technical Chair and the appointment of its Marketing Chair.

Kevin Foster, of BT, is retiring from his role as Chairman of Broadband Forum, a role that he has held since 2012. John Blackford, project lead on the Forum’s Open Broadband – USP Agent (OB-USP-Agent) implementation and Co-director of the BUS Work Area, has been appointed as Chairman. Blackford is involved in some of Broadband Forum’s most innovative work as it prepares fixed networks for the era of 5G and the Connected Home.

Newly appointed to the twelve-member Board: Francisco de Carvalho of BT, Bernd Hesse of Calix, John Blackford of CommScope, David Sinicrope of Ericsson, Frank Van der Putten of Nokia, and
Mauro Tilocca of TIM.

Other members of the Board of Directors include CEO Robin Mersh, Tom Starr of AT&T, Aleksandra Kozarev of Intel, Manuel Paul of Deutsche Telekom, Helge Tiainen of InCoax and Ning Zong of Huawei Technologies.

“As we enter a new era of connectivity, the critically important work within Broadband Forum is helping to shape how broadband evolves,” said Blackford. “I am honored to accept the role of Broadband Forum Chairman and look forward to working with our operator and vendor members and partners to ensure that fixed networks can take full advantage of the myriad of new technologies available in a scalable and cost-effective way through the development of open standards.”

Bernd Hesse was additionally appointed as Marketing Chair. Hesse has been the driving force behind the highly successful Broadband Acceleration Seminar (BASe) initiative at the Forum since 2017. In his capacity as Marketing Chair, he will focus on positioning the work of the Forum in the rapidly changing environment of 5G, high capacity PON, the multi-service Connected Home, SDN and NFV.

At the Q1 meeting, held in Budapest, Hungary, Lincoln Lavoie of the University of New Hampshire Interoperability Lab (UNH-IOL) was also re-elected as Technical Chair. Lavoie has participated in many of the Broadband Forum’s initiatives since 2003, such as projects on testing and interoperability of various broadband technologies, including DSL, Gfast, TR-069, GPON, and NFV/SDN.

“With the rise of open source communities, new disruptive technologies and the rapid pace at which the broadband industry is evolving, building strong partnerships with other organizations is a key part of Broadband Forum’s strategy,” said Robin Mersh, CEO of Broadband Forum. “I am delighted that some world-class leaders have been elected, at what is an exciting and pivotal time for the Forum.”
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